1989. 02. |
|
Company established |
1990. 10. |
|
12 engineers trained in Shinko, Japan |
1990. 11. |
|
MLB 8 layers developed and built mass production system. |
1991. 01. |
|
MLB 10 layers developed and built mass production system.¸³ |
1991. 03. |
|
MLB 14 layers developed and built mass production system. |
1991. 05. |
|
Development of the Impedance Board completed |
1991. 12. |
|
Development of the Burn In Board completed |
1992. 12. |
|
Development of the Chip On Board completed |
1997. 04. |
|
UL acquired |
2000. 08. |
|
ISO9002 certification acquired |
2001. 12. |
|
Functional PCB developed and built mass production system |
2002. 05. |
|
Probe Card 32 layers developed and built mass production system |
2003. 09. |
|
Started mass production of PCB for the military industrial company |
2006. 05. |
|
FPC / Builup Board 4 layers developed |