| 1989. 02. |
|
Company established |
| 1990. 10. |
|
12 engineers trained in Shinko, Japan |
| 1990. 11. |
|
MLB 8 layers developed and built mass production system. |
| 1991. 01. |
|
MLB 10 layers developed and built mass production system.¸³ |
| 1991. 03. |
|
MLB 14 layers developed and built mass production system. |
| 1991. 05. |
|
Development of the Impedance Board completed |
| 1991. 12. |
|
Development of the Burn In Board completed |
| 1992. 12. |
|
Development of the Chip On Board completed |
| 1997. 04. |
|
UL acquired |
| 2000. 08. |
|
ISO9002 certification acquired |
| 2001. 12. |
|
Functional PCB developed and built mass production system |
| 2002. 05. |
|
Probe Card 32 layers developed and built mass production system |
| 2003. 09. |
|
Started mass production of PCB for the military industrial company |
| 2006. 05. |
|
FPC / Builup Board 4 layers developed |