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| BGA |
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One of large scale integrated circuit. Put LSI bare chip On the Square PCB and array domed terminal with the shape of two-dimensional array on the back. Terminal treats with solder. Package of 225~460 pin has been put to practical use. Recently, it is watched because LSI package taking a lot of terminals can be miniaturized. The fact that ‘Motorola’ used it to beeper by developing made it spread. Today, it is used to semiconductor on demand (ASIC) high-speed passive Ram (SRAM) as a package. Recently, the shape has been diversified and kinds based on ceramic and plastic tape (TAB tape) were developed. Kinds using 4~6 multilayers have been developed except both-sided board.
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| MLB |
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-As a stereoscopic PCB having inside and outside circuits, this is a product that able to decrease high density part insertion and wiring distance by stereoscopic wiring.
- Application : Used to mainly large computer, PC, communication
equipment , small appliances |
| HDI |
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High Density Interconnect
⇒As a process confronting with high density & multilayer with fast-growing telecommunication industry, this is a multilayer product of new manufacturing process making layers by stages, Micro Via and Fine Pattern out of multilayer by the existing laminated method.
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| FCBGA |
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Filp Chip Ball Grid Arrays
⇒ Packaging technology using Ball instead of Pin(PGA) or Lead(QFP) when attaching Packaging. Strong to noise because area of part exterior terminal does not protrude. Also, size of approximately 50% became smaller because pin does not protrude. |
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